Postbuckling Behavior of Plates and Shells

Postbuckling Behavior of Plates and Shells

Postbuckling Behavior of Plates and Shells

HUI-SHEN SHEN

220,94 €
IVA incluido
Disponible
Editorial:
WSPC
Año de edición:
2017
Materia
Ingeniería mecánica
ISBN:
9789813146990
220,94 €
IVA incluido
Disponible

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As an expert in structure and stress analysis, the author has written extensively on functionally graded materials (FGMs), nonlinear vibration and dynamic response of functionally graded material plates in thermal environments, buckling and postbuckling analysis of single-walled carbon nanotubes in thermal environments. This book provides a comprehensive overview of the author's works which include significant contributions to the postbuckling behavior of plates and shells under different loading and environmental conditions.This book comprises eight chapters. Each chapter contains adequate introductory material so that an engineering graduate who is familiar with basic understanding of plates and shells will be able to follow it. Chapter 1 introduces higher order shear deformation plate theory and the derivation of the nonlinear equations of shear deformable plates in the von Kármán sense. Chapter 2, covers the postbuckling behavior of thin plates due to in-plane compressive loads or temperature variation. Chapter 3 presents analytical solutions of moderately thick isotropic plates without or resting on elastic foundations. Chapter 4 furnishes a detailed treatment of the postbuckling problems of shear deformable laminated plates subjected to thermal, electrical, and mechanical loads. Chapter 5 put forward a concepts of boundary layer theory for shell buckling and isotropic cylindrical shells. Chapter 6 extends this novel theory to the cases of anisotropic laminated cylindrical thin shells. Chapter 7 presents postbuckling analysis of shear deformable laminated cylindrical shells under the framework of boundary layer theory. Chapter 8 deals with postbuckling behavior of laminated cylindrical panels under various loading conditions.

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