Mechanics of Microelectronics

Microelectronics technology Introduction A heart of silicon In a little black box Baseline CMOS Non-CMOS options Packaging Systems Conclusions References Nomenclature Reliability practices Introduction Reliability assessment Reliability statistics Acceleration factor models Failure mechanisms Conclusions References Exercises Thermal Management Introduction Heat transfer basics Thermal design of assemblies Thermal design for a SQFP Heatsink design choices Conclusions / final remarks References Introduction to Advanced Mechanics Introduction Stress and strain Failure criteria Fracture mechanics Finite element method References Exercises Thermo-Mechanics of Integrated Circuits and Packages Introduction IC Backend and packaging processes and testing Thermo-mechanics of IC backend processes Thermo-Mechanics of packaging processes Thermo-Mechanics of coupled IC backend and packaging processes Case studies References Exercises Characterization and Modeling of Moisture Behavior Introduction Moisture diffusion modeling Characterization of moisture diffusivity and saturation concentration Vapor pressure modeling Hygroscopic swelling characterization & modeling Single void Instability behavior Subjected to vapor pressure and thermal stress Interface strength characterization and modeling Case studies References Exercises Characterization and Modeling of Solder Joint Reliability Introduction Analytical-empirical prognosis of the reliability Thermo-mechanical characteristics of soft solders Data evaluation and LIFE-time estimation Case studies References Exercises Virtual thermo-mechanical prototyping Introduction The state-of-the-art of virtual prototyping Case studies Conclusions References Exercises Challenges and future perspectives Introduction Product and process inputs Tests and experiments Multi-scale mechanics Advanced simulation tools Multi-physics modeling Material and interface behavior Simulation-based optimization Conclusions