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Direct Copper Interconnection for Advanced Semiconductor Technology

Direct Copper Interconnection for Advanced Semiconductor Technology

Dongkai Shangguan

314,36 €
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Editorial:
Taylor & Francis Ltd
Año de edición:
2024
Materia
Ingeniería mecánica
ISBN:
9781032528236

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Sobre IBD

In the 'More than Moore' era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging.

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