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Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Ephraim Suhir

301,10 €
IVA incluido
Consulta disponibilidad
Editorial:
Taylor & Francis Ltd
Año de edición:
2021
Materia
Ingeniería mecánica
ISBN:
9781138624733

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The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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