Solder Joint Reliability

Solder Joint Reliability

John H. Lau

267,44 €
IVA incluido
Disponible
Editorial:
Springer Nature B.V.
Año de edición:
2014
ISBN:
9781461367437
267,44 €
IVA incluido
Disponible

Selecciona una librería:

  • Librería Samer Atenea
  • Librería Aciertas (Toledo)
  • Kálamo Books
  • Librería Perelló (Valencia)
  • Librería Elías (Asturias)
  • Donde los libros
  • Librería Kolima (Madrid)
  • Librería Proteo (Málaga)

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me­ chanical 'glue' of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica­ tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo­ metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder’s uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Artículos relacionados

  • Handbook of Research on Applied Optimization Methodologies in Manufacturing Systems
    Today’s manufacturing systems are undergoing significant changes in the aspects of planning, production execution, and delivery. It is imperative to stay up-to-date on the latest trends in optimization to efficiently create products for the market. The Handbook of Research on Applied Optimization Methodologies in Manufacturing Systems is a pivotal reference source including the...
  • Building a Showcase Culture
    Mark Lado
    This book is for those who want to become factory showcase leaders. Readers learn various tools and techniques along a structured path and will be able to apply them or evaluate their company’s effectiveness. The information is useful for:• Manufacturing Operation leaders• Department and functional staff, supervisors, and team leaders• Students studying engineering, operations,...
    Disponible

    69,17 €

  • Strategic Management of Sustainable Manufacturing Operations
    As companies and organizations continue to grow economically, it has become pertinent to also implement business and management practices that help relieve environmental and social stressors created by manufacturing processes. Strategic Management of Sustainable Manufacturing Operations features an inclusive overview of various management practices that contribute to the sustai...
  • Technological Solutions for Modern Logistics and Supply Chain Management
    Luo
    Technological Solutions for Modern Logistics and Supply Chain Management highlights theories and technological growth in applied research as well as advances in logistics, supply chains, and industry experiences. Aiming to enhance the expansions made towards an efficient and sustainable economy, this book is essential for providing researchers, practitioners and academicians wi...
  • Principles of Wireless Sensor Networks
    Mohammad Obaidat / Sudip Misra
    ...
  • Generic Drugs Formulation Manual
    Francisco De Latorre Quiñónez
    3rd Edition of the book: 'Generic Drugs Formulation Manual: Basic Principles of New Products Development' is an interesting text for all professionals related to the pharmaceutical industry. It is the cornerstone or starting point for the implementation of a unit or a development deparment in those companies that wish to have this type of process within their industries. Franci...
    Disponible

    10,47 €

Otros libros del autor

  • Chiplet Design and Heterogeneous Integration Packaging
    John H. Lau
    The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple syste...
    Disponible

    46,63 €

  • Semiconductor Advanced Packaging
    John H. Lau
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chi...
    Disponible

    149,32 €

  • Semiconductor Advanced Packaging
    John H. Lau
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chi...
  • Heterogeneous Integrations
    John H. Lau
    Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabricatio...
    Disponible

    47,36 €

  • 3D IC Integration and Packaging
    John H. Lau
    A comprehensive guide to 3D IC integration and packaging technology3D IC Integration and Packaging fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inher...
  • Handbook Of Tape Automated Bonding
    John H. Lau
    Handbook of tape automated bonding (TAB) is a one-stop guide to the state of the art of TAB technology - including TAB tape, bump, inner lead bonding, encapsulation, testing, burn-in, outer lead bonding, inspection, rework, thermal management and reliability. For professionals active in TAB research and development, those who wish to master TAB ...