LIBROS DEL AUTOR: john h lau

4 resultados para LIBROS DEL AUTOR: john h lau

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  • Chiplet Design and Heterogeneous Integration Packaging
    John H. Lau
    The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple syste...
    Disponible

    46,63 €

  • Semiconductor Advanced Packaging
    John H. Lau
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chi...
    Disponible

    149,32 €

  • Heterogeneous Integrations
    John H. Lau
    Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabricatio...
    Disponible

    47,36 €

  • Solder Joint Reliability
    John H. Lau
    Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me­ chanical 'glue' of electronic ass...
    Disponible

    267,44 €