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MEMS Packaging Technologies and 3D Integration

MEMS Packaging Technologies and 3D Integration

Seonho Seok

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Editorial:
MDPI AG
Año de edición:
2022
Materia
Biologia, ciencias de la vida
ISBN:
9783036542584

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This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.

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