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Foldable Flex and Thinned Silicon Multichip Packaging Technology

Foldable Flex and Thinned Silicon Multichip Packaging Technology

John W. Balde

205,93 €
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Editorial:
Springer Nature B.V.
Año de edición:
2003
Materia
Informática: cuestiones generales
ISBN:
9780792376767

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Sobre IBD

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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Otros libros del autor

  • Foldable Flex and Thinned Silicon Multichip Packaging Technology
    John W. Balde
    Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substra...
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