LIBROS DEL AUTOR: john lau

7 resultados para LIBROS DEL AUTOR: john lau

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  • Chiplet Design and Heterogeneous Integration Packaging
    John H. Lau
    The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple syste...
    Disponible

    46,63 €

  • Semiconductor Advanced Packaging
    John H. Lau
    The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chi...
    Disponible

    149,32 €

  • A Race Between Time and Money
    John Lau CFP® / Matthew Lau CFP®
    Preparation is key to success in every stage of life, and retirement is no exception. Whether it’s a complete financial overhaul or a simple check-up, this book aims to illuminate the financial issues common in retirement with simple and concise language. Covering topics like Social Security, your 401(k), healthcare, investing, and more, retirement peace of mind starts with kno...
    Disponible

    18,99 €

  • Heterogeneous Integrations
    John H. Lau
    Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabricatio...
    Disponible

    47,36 €

  • Solder Joint Reliability
    John H. Lau
    Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me­ chanical 'glue' of electronic ass...
    Disponible

    267,44 €

  • Thermal Stress and Strain in Microelectronics Packaging
    John Lau
    Microelectronics packaging and interconnection have experienced exciting growth stimulated by the recognition that systems, not just silicon, provide the solution to evolving applications. In order to have a high density/ performance/yield/quality/reliability, low cost, and light weight system, a more precise understanding of the system behavior is re...
    Disponible

    204,78 €

  • The Speculations on Metaphysics, Polity and Morality of The Old Philosopher Lau Tsze
    Lau-Tsze / John Chalmers
    This scarce antiquarian book is a facsimile reprint of the original. Due to its age, it may contain imperfections such as marks, notations, marginalia and flawed pages. Because we believe this work is culturally important, we have made it available as part of our commitment for protecting, preserving, and promoting the world’s literature in affordable, high quality, modern edit...
    Disponible

    12,60 €