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Through Silicon Vias

Through Silicon Vias

Brajesh Kumar Kaushik / Manoj Kumar Majumder / Vobulapuram Ramesh Kumar

94,14 €
IVA incluido
Disponible
Editorial:
Taylor & Francis Ltd
Año de edición:
2020
Materia
Física
ISBN:
9780367574543
94,14 €
IVA incluido
Disponible

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Sobre IBD

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and ph

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