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Simulation and Reliability Assessment of Advanced Packaging

Simulation and Reliability Assessment of Advanced Packaging

Kuo-Ning Chiang

89,21 €
IVA incluido
Consulta disponibilidad
Editorial:
MDPI AG
Año de edición:
2024
Materia
Tecnología: cuestiones generales
ISBN:
9783725809721

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  • Librería Samer Atenea
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Sobre IBD

Topics covered in this reprint include material characterization, theoretical and empirical methods, modeling, simulation technology, design and validation, and AI-assisted design-on-simulation technology for electronic packaging. Package design engineers, researchers, and graduate students involved in thermal/mechanical modeling, package design, material selection, qualification, and reliability assessment of advanced packaging will benefit from this reprint.

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