Lead Free Solder

Lead Free Solder

John Hock Lye Pang

159,01 €
IVA incluido
Disponible
Editorial:
Springer Nature B.V.
Año de edición:
2014
ISBN:
9781489991164
159,01 €
IVA incluido
Disponible

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Sobre IBD

Introduction.- Theory on Mechanics of Solder Materials.-Mechanical Properties and Constitutive Models.- Fatigue Life Prediction Models.- Finite Element Analysis and Design-For-Reliability.- Thermo-Mechanical Reliability Test and Analysis.- Dynamic Mechanical Reliability Test and Analysis.- Thermal Cycling Aging Effects on Board-Level Drop Test Result

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Otros libros del autor

  • Lead Free Solder
    John Hock Lye Pang
    Lead-free solders are used extensively as interconnection materials in electronic assemblies and play a critical role in the global semiconductor packaging and electronics manufacturing industry. Electronic products such as smart phones, notebooks and high performance computers rely on lead-free solder joints to connect IC chip components to printed circuit boards. Lead Free So...