Inicio > Artes > Arte y diseño industrial / comercial > Diseño de productos > Integrated Circuit Packaging, Assembly and Interconnections
Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections

William Greig

170,63 €
IVA incluido
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Editorial:
Springer Nature B.V.
Año de edición:
2010
Materia
Diseño de productos
ISBN:
9781441939234
170,63 €
IVA incluido
Disponible

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Sobre IBD

Electronic Manufacturing and the Integrated Circuit.- Integrated Circuit Manufacturing: A Technology Resource.- Packaging the IC-Single Chip Packaging.- The Chip Scale Package.- Multichip Packaging.- Known Good Die (KGD).- Packaging Options-Chip on Board.- Chip & Wire Assembly.- Tape Automated Bonding-TAB.- Flip Chip-The Bumping Processes.- Flip Chip Assembly.- HDI Substrate Manufacturing Technologies: Thin Film Technology.- HDI Substrate Manufacturing Technologies: Thick Film Technology.- HDI Substrate Manufacturing Technologies: Cofired Ceramic.- Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.

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