ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS

ADVANCES IN 3D INTEGRATED CIRCUITS AND SYSTEMS

Advances in 3D Integrated Circuits and Systems

Chuan-Seng Tan / Hao Yu / HAO YU & CHUAN-SENG TAN / YU HAO

60,91 €
IVA incluido
Disponible
Editorial:
World Scientific Publishing Co Pte Ltd
Año de edición:
2015
ISBN:
9789814699013
60,91 €
IVA incluido
Disponible

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Sobre IBD

 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

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