LIBROS DEL AUTOR: xingcun colin tong

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  • Advanced Materials for Thermal Management of Electronic Packaging
    Xingcun Colin Tong
    The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from ac...
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    223,50 €