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LIBROS DEL AUTOR: xing chang wei

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Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging

Xing-Chang Wei

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power ...

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84,98 €