LIBROS DEL AUTOR: shichun qu

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  • Wafer-Level Chip-Scale Packaging
    Shichun Qu / Yong Liu
    Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers i...
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    196,56 €