LIBROS DEL AUTOR: qingke zhang

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  • Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces
    Qingke Zhang
    This thesispresents a series of mechanical test methods and comprehensively investigatesthe deformation and damage behavior of Cu/Pb-free solder joints under differentloading conditions. The fracture behavior of Pb-free joint interfaces inducedby stress, deformation of solder and substrate are shown, the shear fracturestrength of the Cu6Sn5 IMC is measured experimentally for th...
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