LIBROS DEL AUTOR: krishna tunga

1 resultados para LIBROS DEL AUTOR: krishna tunga

  • Study of SnAgCu Alloy Reliability
    Krishna Tunga
    This work aims to understand the reliability ofSnAgCu solder interconnects used in PBGA packagesusing microstructure evolution, laser moiréinterferometry and finite-element modeling. Aparticle coarsening based microstructure evolution ofthe solder joint material during thermal excursionswas studied for extended periods of time lasting forseveral months. The microstructure evolu...
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