LIBROS DEL AUTOR: junjing bao

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  • Plasma and Low-κ Dielectric Materials
    Junjing Bao
    With the scaling of devices, integration of porous ultra low-k materials into Cu interconnect becomes imperative. Low-k dielectric materials consist of methyl groups and pores incorporated into a silicon dioxide backbone structure to reduce the dielectric constant. Plasma is widely used in semiconductor industry for deposition, etching, stripping etc. This book explores the int...
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    97,52 €