LIBROS DEL AUTOR: jishen zhao

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  • Die-stacking Architecture
    Jishen Zhao / Yuan Xie
    The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the 'memory wall' problem. In addition, heterogenous integration...
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    61,22 €