LIBROS DEL AUTOR: jennie s hwang

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  • Solder Paste in Electronics Packaging
    Jennie S. Hwang
    One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the ...
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